Our mission is to innovate, design, and deliver semiconductor-based connectivity solutions that are purpose-built to unleash the full potential of cloud and AI infrastructure. (Incorporated in Delaware) 

Building on years of experience with a singular focus on addressing connectivity challenges in data-centric systems, we have developed and deployed our leading Intelligent Connectivity Platform built from the ground up for cloud and AI infrastructure. Our Intelligent Connectivity Platform comprises:

1. i) Semiconductor-based, high-speed, mixed-signal connectivity products that integrate a matrix of microcontrollers and sensors; and

2. ii) COSMOS, our software suite which is embedded in our connectivity products and integrated into our customers’ systems.

Our Intelligent Connectivity Platform provides our customers with the ability to deploy and operate high-performance cloud and AI infrastructure at scale, addressing an increasingly diverse set of requirements. We provide our connectivity products in various form factors including ICs, boards, and modules.

AI touches many aspects of our daily lives today, from vision processing for autonomous vehicles to speech recognition systems for chatbots. According to IDC, by 2025, the Global 2000 organizations will allocate over 40% of their core IT spend to AI-related initiatives, leading to a double-digit increase in the rate of product and process innovations. The shift towards the cloud from on-premise computing is rapidly accelerating due to increasing demand for compute-intensive AI workloads that are truly optimized when deployed at cloud scale.

To address the performance and scalability requirements of AI and other compute-intensive applications, hyperscalers have adopted heterogeneous, “accelerated computing” system architectures within their data centers, which include GPUs and other AI accelerators, such as TPUs, AI processors, custom ASICs, and FPGAs, to target specific workloads. These new system architectures require a connectivity backbone that is significantly faster, has lower latency, is robust, and supports cloud scale deployment.

Our patented software-defined platform approach delivers critical connectivity performance, enables flexibility and customization, and supports observability and predictive analytics. This approach efficiently addresses the data, network, and memory bottlenecks, scalability, and other unique infrastructure requirements of our hyperscaler and system OEM customers.

Based on trusted relationships with the leading hyperscalers and collaboration with data center infrastructure suppliers such as NVIDIA, Advanced Micro Devices, Intel, and many others, our platform is designed to meet our customers’ unique cloud scale requirements. Our COSMOS software suite is foundational to our Intelligent Connectivity Platform and is designed to enable our customers to seamlessly configure, manage, monitor, optimize, troubleshoot, and customize functions in our IC, board, and module products.

We believe that our Intelligent Connectivity Platform addresses a large and growing total addressable market (“TAM”) of $17.2 billion. Specifically, our technology and product portfolios target the global wired connectivity market, including PCIe and Ethernet, and the CXL memory connectivity controller market. We believe that our TAM will grow to $27.4 billion by 2027, and we expect to address an increasing share of this TAM as we expand the breadth and depth of our product portfolio. See the section titled “Business—Our Market Opportunity” for additional information on how we calculate our TAM.

Today, our connectivity solutions are at the heart of major AI platforms deployed worldwide featuring both commercially available GPUs and proprietary AI accelerators. In the last four years, we have successfully introduced three revenue-generating product families across multiple form factors including ICs, boards, and modules, shipping millions of devices across all of the major hyperscalers. Our products, which include Aries PCIe^®/CXL^™ Smart DSP Retimers (“Aries”), Taurus Ethernet Smart Cable Modules^™ (“Taurus”), and Leo CXL Memory Connectivity Controllers (“Leo”), leverage our ICs that are built upon industry standard connectivity protocols such as PCIe, Ethernet, and CXL to address the growing demand for purpose-built connectivity solutions that solve critical data, network, and memory bottlenecks inherent in cloud and AI infrastructure.

Since our inception, we have created and commercialized first-to-market PCIe, Ethernet, and CXL products, and, with more than 300 design wins, we have become a trusted partner and a proven supplier to our hyperscaler and system OEM customers. We have experienced strong growth since our founding in October 2017, and particularly since the commercial launch of Aries in 2020.

(Note: Astera Labs, Inc. priced its IPO at $36.00 – $2.00 above the top of its increased range – on 19.8 million shares – the number in the prospectus – to raise $712.8 million on Tuesday night, March 19, 2024.)

(Note: Astera Labs, Inc. increased the size of its IPO to 19.8 million shares – up from 17.8 million shares – and raised the price range to $32.00 to $34.00 – up from the previous price range of $27.00 to $30.00 – to raise $653.4 million, according to an S-1/A filing early Monday, March 18, 2024.)

(Note: Astera Labs, Inc. unveiled the terms for its IPO – 17.8 million shares at a price range of $27.00 to $30.00 to raise $507.3 million, in an S-1/A filing dated March 8, 2024. The company plans to offer 14.79 million shares and selling stockholders will offer 3.01 million shares, according to the prospectus. Astera Labs will not receive any proceeds from the sale of the selling stockholders’ shares. Background: Astera Labs, Inc. filed its S-1 (prospectus) dated Feb. 20, 2024, without disclosing the terms or the proposed stock symbol for its IPO. Estimated IPO proceeds are $100 million, a placeholder figure for an IPO that some on Wall Street believe could raise $500 million or more.)